BGA Reballing Preform -Configurable

This is a unique BGA reballing stencil. It improves first pass yields and makes the reballing of devices fast and simple.

This BGA reballing stencil allows you to easily change alloys or reball devices after their removal.

BGA reballing stencils come in a variety of alloys including but not limited to : tin-lead, lead free (SAC 305), high temp

More information on the testing of this device can be found here.

• Minimum Aperture Size: .002in (.05mm)

• Stencil Material: High temperature Polyimide with tacky, porous tape which cleans up with IPA.
  

• Minimum Pitch: 1.50-0.50mm pitch
  

• Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)

We accept either standard GERBER files, part data sheets or CAD files.

This configurable part number for this reballing stencil means you do not have to sort through all of the patterns listed (there are many more).

If you need an EZReball(TM) in a pitch smaller than 0.5mm pitch order here.

The data you send us to make your part must have:

         # of solder balls

         Pattern of the solder array incl dimensions

         Overall package size

         Ball size

We will send you a checkplot/drawing of the device we will fabricate for you.

EZReball(TM) BGA reballing stencils are packaged in groups of (15) in clam shell packaging.

Standard lead time is (3) business days for 2 packs. NOTE: There is no need for alignment fixtures as the patterns square up to the package dimensions for alignment.