This is a unique BGA reballing stencil. It improves first pass yields and makes the reballing of devices fast and simple.
This BGA reballing stencil allows you to easily change alloys or reball devices after their removal.
BGA reballing stencils come in a variety of alloys including but not limited to : tin-lead, lead free (SAC 305), high temp
More information on the testing of this device can be found here.
- Minimum Aperture Size: .002in (.05mm)
- Stencil Material: High temperature Polyimide with tacky, porous tape which cleans up with IPA.
- Minimum Pitch: 1.50-0.50mm pitch
- Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)
We accept either standard GERBER files, part data sheets or CAD files.
This configurable part number for this reballing stencil means you do not have to sort through all of the patterns listed (there are many more).
If you need an EZReball(TM) in a pitch smaller than 0.5mm pitch order here.
The data you send us to make your part must have:
# of solder balls
Pattern of the solder array incl dimensions
Overall package size
Ball size
We will send you a checkplot/drawing of the device we will fabricate for you.
EZReball(TM) BGA reballing stencils are packaged in groups of (15) in clam shell packaging.
Standard lead time is (3) business days for 2 packs. NOTE: There is no need for alignment fixtures as the patterns square up to the package dimensions for alignment.
19 Reviews Hide Reviews Show Reviews
-
Simple to Use
Fast and quick once you get the hang of this. Novel device!
-
Nice product for 0.4mm pitch BGA
Once I got in touch with Katy things sailed along-otherwise a little "choppy" to begin with on the web site.
-
Got my 130 ball chip re-balled on the first try
I took a photo-micrograph of the re-balled part with some common table salt and the size comparison made those .30mm balls look so tiny. No more hand re-balling for me. Pays for it's self in time saved.
-
Fast and painless
Chris helped me out. Got me a drawing of the preform would look like. It shipped a few days later. Product works great!
-
Simple to Use, Good customer servive
Product is easy as long as you follow the video. Chris was nice
-
Fast delivery, works well
I had been using the paper preforms. These are a very good alternative as there are no toolings costs.
-
Ultra Fine Pitch Solved
I have been looking for someone to find me a good answer for my 0.35mm pitch CSPs. This was a good solution!
-
Fast shipping
Got the preforms in 4 days after submitting and approving the checkplot on a new pattern. No extra $ like WS.
-
Even tiny devices can be reballed
I had a 0.4mm pitch with 10 mil ball BGA that needed to have new balls placed on it after the device was taken off the board. This was a neat easy way to do this myself.
