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EZReball(TM)

$140.00
(4 reviews) Write a Review
SKU:
EZReball(TM) New Pattern Pitch Greater Than 0.4mm
Weight:
0.50 LBS
Shipping:
Calculated at Checkout

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This is a unique BGA reballing preform for pitches greater than 0.4mm for new parts where you have a mechanical part specification which can be uploaded.

EZReball(TM)  improves first pass yields and makes the reballing of devices fast and simple.

This BGA reballing stencil allows you to easily change alloys or reball devices after their removal.

BGA reballing stencils come in a variety of alloys including but not limited to : tin-lead, lead free (SAC 305) high temp 

  • Minimum Aperture Size: .002in (.05mm)
  • Stencil Material: High temperature Polyimide with tacky, porous tape which cleans up with IPA.
  • Minimum Pitch: 1.50-0.50mm pitch
  • Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)

This is for those  who desire and EZReball(TM) for a specific pattern that will be uploaded as part of an order.

We will send you a checkplot/drawing after receipt of order and acceptance for your approval.

EZReball(TM) BGA reballing stencils are packaged in groups of (15) in clam shell packaging.

Standard lead time is (3) business days for 2 packs. NOTE: There is no need for alignment fixtures as the patterns square up to the package dimensions for alignment.

4 Reviews Hide Reviews Show Reviews

  • 5
    Nicely Done

    Posted by Jason F on 14th Dec 2021

    This greatly simplified putting balls onto a removed BGA

  • 4
    Fast way to re-attach solder spheres

    Posted by Luan C on 16th Jun 2021

    Nice product

  • 4
    Product Easy to Use

    Posted by Quan L on 28th May 2021

    After looking at the video this was easy to use

  • 5
    Simple product to use

    Posted by Win L on 21st Dec 2020

    Videos and instruction sheet were well done

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