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RB27212727027076

$140.00
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SKU:
RB27212727027076
Availability:
Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
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BGA Reball Preform

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices.The quantity is 15 per bag.

  • Stencil Thickness:0.015
  • Aperture Size:.76mm
  • Ball Count:272
  • Ball Pattern:27x27mm
  • Pitch: 1.27 mm

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